Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
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